This standard establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within Military and Aerospace electronic systems including basic environmental tests to determine resistance to deleterious effects of natural elements and conditions surrounding military and space operations; mechanical and electrical tests; workmanship and training procedures; and such other controls and constraints as have been deemed necessary to ensure a uniform level of quality and reliability suitable to the intended applications of those devices.
 

 
For the purpose of this standard, the term "devices" includes such items as monolithic, multichip, film and hybrid microcircuits, microcircuit arrays, and the elements from which the circuits and arrays are formed. This standard is intended to apply only to microelectronic devices

Source: DSCC MIL-STD-883 Group

 


  Method 1001 Low Pressure Testing (A-O)   Method 1012 Thermal Characteristics  
    The barometric-pressure test is performed under conditions simulating the low atmospheric pressure encountered in the non-pressurized portions of aircraft and other vehicles in high-altitude flight. This test is intended primarily to determine the ability of component parts and materials to avoid voltage breakdown failures due to the reduced dielectric strength of air and other insulating materials at reduced pressures.
    

The purpose of this test is to determine the thermal characteristics of microelectronic devices. This includes junction temperature, thermal resistance, case, mounting temperature, and thermal response time of the microelectronic devices.

  
  Method 1002 Immersion Testing (A-C)   Method 1013 Dew Testing  
    This test is performed to determine the effectiveness of the seal of microelectronic devices.     The purpose of this test is to detect the presence of moisture trapped inside the microelectronic device package in sufficient quantity to adversely affect device parameters.  
  Method 1003 Insulation Resistance Testing   Method 1015 Burn-In  
    This test is to measure the resistance offered by the insulating members of a component part to an impressed direct voltage tending to produce a leakage of current through or on the surface of these members.     The burn-in test is performed for the purpose of screening or eliminating marginal devices, those with inherent defects or defects resulting from manufacturing aberrations which cause time and stress dependent failures.  
  Method 1004.7 Moisture Resistance   Method 2002.2 Mechanical Shock  
    The moisture resistance test is performed for the purpose of evaluating, in an accelerated manner, the resistance of component parts and constituent materials to the deteriorative effects of the high-humidity and heat conditions typical of tropical environments.     The shock test is intended to determine the suitability of the devices for use in electronic equipment which may be subjected to moderately severe shocks as a result of suddenly applied forces or abrupt changes in motion produced by rough handling, transportation, or field operation.  
  Method 1005.8 Steady State Life   Method 2005.2 Vibration Fatigue  
    The steady-state life test is performed for the purpose of demonstrating the quality or reliability of devices subjected to the specified conditions over an extended time period.     The purpose of this test is to determine the effect on the device of vibration in the frequency range specified.  
  Method 1007 Agree Life Testing   Method 2007.3 Vibration  
    The purpose of this test is to determine a representative failure rate for microelectronic devices or to demonstrate quality or reliability of devices subjected to the specified conditions where test conditions include a combination of temperature cycling, on-off electrical stressing and vibration to simulate as closely as possible actual system applications and environments.     The variable frequency vibration test is performed for the purpose of determining the effect on component parts of vibration in the specified frequency range.  
  Method 1009.8 Salt Atmosphere Testing   Method 2015 Resistance to Solvents  
    This test is proposed as an accelerated laboratory corrosion test simulating the effects of seacoast atmosphere on devices and package elements.     The purpose of this test is to verify that the markings will not become illegible on the component parts when subjected to solvents.  
  Method 1010.8 Temperature Cycle Testing   Method 2026 Random Vibration  
    This test is conducted to determine the resistance of a part to extremes of high and low temperatures, and to the effect of alternate exposures to these extremes     This test is conducted for the purpose of determining the ability of the microcircuit; to withstand the dynamic stress exerted by random vibration applied between upper and lower frequency limits to simulate the vibration experienced in various service-field environments.  
  Method 1011 Thermal Shock Testing      
    The purpose of this test is to determine the resistance of the part to sudden exposure to extreme changes in temperature and the effect of alternate exposures to these extremes.        
 
 
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